It is an advance product developed from double-sided FPC. Increasing the complexity of circuits to greater degrees, it is typically applied in current high tech digital products, especially in circuits of color screen mobile phones.

 

*Multilayer FPC - Material: Polyimide, Copper; Copper: 0.5 oz, RA; Cover layer: Polyimide, 0.5 mil; Thickness: 0.23+0.05mm; Line Width/Space: 6mil/6mil; Surface Finishing: Immersion Gold; Smallest Hole Diameter: 0.3mm.

*Multilayer FPC - Material: Polyimide, Copper; Copper: 0.5 oz, RA; Cover layer: Polyimide, 0.5 mil; Thickness: 0.23+0.05mm; Line Width/Space: 5.7mil/6mil; Surface Finishing: Immersion Gold; Smallest Hole Diameter: 0.3mm.