. Power Module Material: Ceramic+FR4+Copper base Layer Coverage: 4 Layers+Copper base Surface Technique: Immersion Gold Specialty: Ceramic+FR4 Multiply materials copper-clad laminate.

. O-E Module Material: Ceramic+FR4 Layer Coverage: 6 Layers Thickness: 1.0 mm Surface Technique: Gold-plate +finger Specialty: Embedded Orientation.

. Embedded Systems Material: FR4 Layer Coverage: 8 Layers Thickness: 1.6 mm Surface Technique: HAL Line Width/Space: 4mils/4mils Solder Mask Color: Yellow.

. DC/DC Power Module Material: Hi-Tg (170 Cels. degree), FR4 Layer Coverage: 10 Layers Thickness:1.6 mm Surface Technique: Immersion Gold Specialty: Copper Weight 105 um Blind-via/Buried-via Larger Current .

. Telecommunication base-station Material: FR4 Layer Coverage: 8 Layers Thickness:2.0 mm Surface Technique: HAL Line Width/Space: 4mils/4mils Specialty: BGA, Impedance Control, Shade Solder.

. Data Collect Material:FR4 Layer Coverage: 6 Layers Thickness:1.6 mm Surface: Electrolytic Au + Finger Au Weight Of Finger: 30 microinch Solder Mask Color: blue Blind-via.